X/XS/XSMAX Phone Motherboard Layered Test Frame Stand
Design of the card groove can solve the
problem of testing SIM card function
Abrasive blasting process can increase the
friction and achieve the anti-slip effect
Good conductivity, to connect the
motherboard with more accuracy
Exquisite production process and strict screening
are only for more efficient motherboard testing
To control every little detail
No gasket is needed
Gasket is needed
Different test frame stands are used for
different phone motherboards
Brand: Mega-Idea
Product：Motherboard Layered Test Frame Stand
Application Temperature：-50℃~300℃
Measurement Unit：Milimeter(mm)
Model 1：phone X
Model 2：phone XS/XS MAX
Model 3：phone 11
Model 4：phone 11pro/pro max
【X/XS/XSMAX Motherboard Layered Test Frame Stand】
